What is IC Packaging?
Any IC used in a certain system operates at wide temperature variation from extreme cold to hot, Voltage bias changes, different weather conditions including humidity and stress. Packaging is a solution which protects the semiconductor circuit material from any physical damage or corrosion and also such that it can be mounted on any PCB.
Different types of IC packaging solutions and how we can help you with it:
We at RFIC Solutions, can help your design find different packaging solutions. Based on your requirements we will recommend the right package for your chip which best suits your needs. Not only that, we can also simulate the design with the package model in EM environment on our CAD Tool to account for all the parasitic effects to help you understand how the device measurement performance be like.
Quad Flat No-Leads (QFN) package:
QFN is a lead frame package with the ability to view and contact the lead after assembly. It typically uses copper lead frame for the die assembly and PCB interconnection. We will use the QFN package model integrated with your design and simulate it with all the bond wire inductance connecting each and every pin of the IC to that of the package in EM environment.
Ball Grid Array (BGA):
BGA is chip carrying surface mount package in which entire bottom surface can mount. Mostly used in Computers. Due to smaller ball connections, better performance at higher speeds are achieved. We will use the right BGA model with the device model including the smaller ball connections on the package mounted on the PCB and EM simulate it to show how the packaged ICs performance are due to the parasitic effects of the same.
Wafer Like Package (WLP):
Wafer like packaging, a chip scale packaging technology, as the name suggests is practically the same size as the die while still part of the wafer. In this, there is no need to dice the wafer to get the individual die and then packaging them as is the case in general. This helps in the integration of wafer fab, packaging, test and burn in at wafer level itself. It streamlines the process from silicon start to customer shipment. With the appropriate WLP model integrated with the bare die on wafer we can simulate them to help you with the close to reality performance across process which will ultimately help in saving the cost and time used in the entire chip development process.